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Ai

Intel®Wildcat Lake; LPDDR5, UFS 3.1; dual HDMI®/eDP; 2.5GbE; USB 3.2, USB 2.0; M.2 E-Key; TPM, GPIO, I2C/SMBus, Smart FAN
220W DC/DC 9-36V input/ATX output Board type Converter
COM Express Type 6 Compact Size Module with AMD Ryzen™ Embedded 8000 Processor, DDR5 SO-DIMM, DDI, eDP, LVDS, VGA, PCIe Gen 4, USB 3.2 Gen2, discrete TPM 2.0, SATA, Out-of-Band (OOB) Management
Intel®New Gen Core™ ultra; 2x DDR5 SO-DIMM to 128GB IBECC; 20 PCIe Gen4 lanes; 4x USB 3.2 Gen2; 3x DDI, eDP/LVDS
SMARC 2.2 Compliant module (82 x 50 mm) powered by Intel®Alder Lake-N, Amston Lake (Atom® x7000RE), and Twin Lake (Core Processor N) Series SoCs, featuring onboard LPDDR5 SDRAM
Intel®TWIN/Amston Lake Atom ® Processor based 3.5’’ embedded Board with DDR5 SO-DIMM, Gigabit Ethernet, 3x M.2 sockets, 6x COM ports and 9~36V DC input
PNAC-31110 builds on Intel®Denverton C3758R 1U rackmount system with up to 8x ETH ports , 1x Proprietary ETSFF OCP NIC 3.0 Slot.
1 U Rackmount System with Intel®Amston Lake x7809C(8C) Processor for SD-WAN solution
NVIDIA Jetson Orin AI module; 2x 2.5GbE RJ45 with PoE+; 1x M.2 Key-M 2242/60 (PCIe x4); OCP design based
Portwell Proprietary ETSFF PoE+ Switch Expansion Card for OCP NIC 3.0
Intel®Core™ Processor Series 2 and 12th/13th/14th Generation chipset 600 series with processor based on PICMG 1.3 SHB with DDR5 SDRAM, HDMI®, DVI-D, DP, Dual 2.5Gigabit Ethernet, Audio and USB
Intel®Core™ Processor Series 2 and 12th/13th/14th Generation chipset 600 series with processor based on PICMG 1.3 SHB with DDR5 SDRAM, HDMI®, DVI-D, DP, Dual 2.5Gigabit Ethernet, Audio and USB
Intel®Core™ Ultra Series; 2x DDR5 6400 ECC SO-DIMM to 96GB; 2.5GbE; 6x USB 3.2 Gen2; mini-DP, 2x HDMI®
Intel®Core™ Ultra Processors; 2x DDR5 Long-DIMM up to 96GB; PCIe x16, PCIe x8, 2x PCIe x4, 1x M.2 key M; dual LAN, 6x COM, 4x USB 3.2, 4x SATA III
Embedded Rugged Fan-less System with Intel®Core™ Processors (Series 2) and Intel®Core™ Processors (Series 2) with P-cores based Mini-ITX Board